 服务项目 |
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| FR-4硬板-12层板-PCB线路板 |
FR-4硬板-12层板
| PCB Type: |
HDI PCB |
| Structure: |
ELIC |
| Layer Count: |
12L |
| Min.Line Width/Space: |
2.5/2.5mil |
| Min.Via Diameter: |
4mil Laser via/9mil padsize |
| Finish Thickness: |
1.0mm |
| Surface Finish: |
OSP+ENIG |
| Material: |
EMC Mid Tg material |
| Color: |
Blue |
| Application: |
Smatr Phone |
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